发明名称 Semiconductor memory device having cylindrical capacitor and manufacturing method thereof
摘要 The semiconductor memory device includes a semiconductor substrate 1 having a conductive layer 6 formed on its main surface. Word lines 4c, 4d and a bit line 11 is formed on the semiconductor substrate. Insulating films 8, 12 are provided to cover the word lines 4c, 4d and the bit line 11. A barrier film 14 is provided on the insulating films 8, 12 for protecting the insulating films 8, 12 from etchant. A cylindrical storage node 170 is electrically connected to the conductive layer 6. The cylindrical storage node 170 includes a bottom conductive portion 17a and a sidewall conductive portion 17b. An outer surface of the storage node 170 is covered with a capacitor insulating film 112. The outer surface of the cylindrical storage node 170 is covered with a cell plate 22, with the capacitor insulating film 112 interposed therebetween.
申请公布号 US5408114(A) 申请公布日期 1995.04.18
申请号 US19930070521 申请日期 1993.06.03
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 KINOSHITA, MITSUYA;OKAMOTO, TATSUO;ARIMA, HIDEAKI;HACHISUKA, ATSUSHI
分类号 H01L27/04;H01L21/822;H01L21/8242;H01L27/10;H01L27/108;(IPC1-7):H01L29/68 主分类号 H01L27/04
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