Method of encapsulating temperature sensitive devices in wax-like material having a high coefficient of fusion

摘要

A method of encapsulating temperature-sensitive electronic devices such as solid state memory devices used in aircraft for recording flight data and the like in a wax-like material having a high heat of fusion to establish a heat sink for protecting the device against intense heat resulting from fire includes the preparation of a wax "preform" under heat and pressure in a closed chamber for minimizing oxidation thereof and thereafter transferring the preform by the application of heat and pressure to move the material in a softened condition into a mold cavity supporting the memory devices and forming the material to encapsulate a printed circuit board, carrying memory devices to exclude air and protect the same from deleterious effects of intense heat.