发明名称 |
METHOD FOR ASSEMBLING AN ELECTRONIC PACKAGE |
摘要 |
There is disclosed a process for the assembly of an electronic package (30) in which the outer lead ends (14) of a leadframe (50) are solderable (38) to external circuitry (36) without the necessity of a tin or solder coat. An oxidation resistant layer (44) is deposited on the leadframe (50) prior to package (30) assembly. The oxidation resistant layer (44) is removed prior to outer lead (14) soldering (38) providing a clean, oxide free metallic surface (46) for soldering (38). |
申请公布号 |
WO9509437(A1) |
申请公布日期 |
1995.04.06 |
申请号 |
WO1994US10439 |
申请日期 |
1994.09.16 |
申请人 |
OLIN CORPORATION |
发明人 |
MAHULIKAR, DEEPAK;PARTHASARATHI, ARVIND |
分类号 |
H01L23/28;H01L21/56;H01L23/495;H01L23/50;H05K3/34 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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