| 摘要 |
<p>PURPOSE:To provide a mounting structure for an IC module which has excellent heat dissipation and in which damage, peeling due to a residual thermal stress is prevented. CONSTITUTION:A peripheral edge of a module base material 14 is adhered at a recess 13 engaging type IC module 12 with adhesive 17. A cavity 18 is demarcated between a molding resin 16 and the recess 13, and a filler 19 is filled into the cavity 18. Heat at the time of adhering is dissipated via the filler 19. The filler 19 also has a buffer action against an external force. Further, a pinhole 21 is formed instead of the filler in a bottom wall of a card base material 11. In addition, heat sink 31 is inserted into the cavity 18 instead of the filler 19, the pinhole 21. A disconnection of a bonding wire of the module 12 is prevented by heat dissipation of the material 31.</p> |
