| 摘要 |
PURPOSE:To efficiently polish irregularity, which must be polished, due to a wiring pattern or the like with irregularity, due to thickness non-uniformity of a wafer and its warp, left as it is by arranging a polishing head of diameter smaller than the wafer. CONSTITUTION:A wafer 1 is fixed by placing its polished surface upward to a wafer chuck 2, and this wafer cluck 2 is rotated at about 50rpm to also supply slurries 6a, 6b by about a 10ml/minute rate to an upper surface of the wafer 1. A polishing head 3 of diameter smaller than the wafer l is rotated at about 1000rpm, and while pressing a polishing cloth 4 to a polished surface of the wafer 1 at a pressure of about 500g weight/cm<2>, the polishing head 3 makes a reciprocating motion on the polished surface, to polish the wafer 1. Here, a reciprocating motion width of the polishing head 3 is set equal to about a radius of the wafer 1. |
