| 摘要 |
A process for the manufacture of tinplates comprising electroplating a substrate in a fused-chloride tin plating bath at a temperature of about 150 DEG to 350 DEG C., a current density of about 100 to 500 A/dm2 in an atmosphere of a non-oxidizing gas. This process may be converted to a process for the manufacture of reflow type tinplates by only changing the bath temperature, and vice versa. For the manufacture of no-reflow type tinplates, the bath is kept at 150 DEG to 232 DEG C., while for the manufacture of reflow type tinplates, the bath is kept at 233 DEG to 350 DEG C. In these cases, the bath includes SnCl2 and at least one member selected from the group consisting of KCl, NaCl, LiCl and AlCl3, and may preferably be operated while flowing the bath at a flow rate of about 0.1 m/sec higher. There is provided equipment for the manufacture of tin-plated steel strip comprising a pretreating apparatus for cold rolling steel strip, an annealing apparatus, a skin pass rolling apparatus, a fused-salt tin-electroplating apparatus with the above bath including chlorides, and an aftertreating apparatus, these apparatus being continuously integrated into the equipment by use of a fused-salt bath.
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