发明名称 Method for producing a semiconductor light emitting device
摘要 A surface emitting type of light emitting devices has a narrow emanating region near the front surface. A spherical lens is fixed on the front surface or rear surface for converging light beams to a core of an optical fiber. Prior devices determined the position of the spherical lens by forming a concavity or a set of protrusions on the rear surface. Two wafer processes were required to form the concavity or protrusions. Two wafer processes on both surfaces induced not a little positioning error. This invention does not form concavities nor protrusions on the rear surface. The rear surface is ground and left flat. Second electrode is formed on the rear surface, not hindering light to emit through. The center of the emanating region is determined by supplying current to the device and illuminating the emanating region. The emanating pattern is observed by a TV camera connected to a computer. The center of the emanating region is detected by image processing of the illuminated pattern. The position of the center is memorized. Adhesive is supplied to the rear surface of the chip. A spherical lens is carried to a spot of the memorized coordinate. The adhesive is hardened in a moment to fix the lens at the spot.
申请公布号 US5403773(A) 申请公布日期 1995.04.04
申请号 US19930088639 申请日期 1993.07.09
申请人 SUMIMOTO ELECTRIC INDUSTRIES, LTD. 发明人 NITTA, TOSHIYUKI;IWASAKI, TAKASHI
分类号 G02B3/00;H01L33/44;H01L33/58;(IPC1-7):H01L21/20 主分类号 G02B3/00
代理机构 代理人
主权项
地址
您可能感兴趣的专利