发明名称 |
Thin, stress-balanced insulating substrate for mounting semiconductor devices |
摘要 |
An insulating substrate for mounting semiconductor devices that is composed of a thin flat plate of inexpensive alumina (Al2O3) preferably in the range of 0.26 to 0.29 mm in thickness. Copper foil sheets are applied to both sides of the flat plate with edges spaced a distance back from the end surface of the plate to increase air path distance between the edges of the sheets of foil applied to opposite sides of the plate. The difference in distance between the end surface of the alumina plate and the edges of each copper foil is 0.5 mm or less to balance thermal stress upon heating and cooling of semiconductors soldered to the copper foil.
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申请公布号 |
US5403651(A) |
申请公布日期 |
1995.04.04 |
申请号 |
US19930168407 |
申请日期 |
1993.12.17 |
申请人 |
FUJI ELECTRIC CO., LTD. |
发明人 |
MIYAGI, MASAHIDE |
分类号 |
H01L21/48;H05K1/02;H05K1/03;(IPC1-7):B32B9/00 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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