发明名称 |
Surface mountable integrated circuit package with integrated battery mount |
摘要 |
An integrated circuit package of the surface-mountable type within which a battery is mounted is disclosed. Battery leads extend from the side of the package body opposite that which is adjacent the circuit board when mounted, and between which a conventional battery may be placed. Standoffs are located on the package body for supporting the battery above the package body, so that a gap is present therebetween. A housing is attached to the package over the battery, and has standoffs attached to its inner surface so that a gap is also present between the housing and the battery. The gaps may be air gaps or filled with a low thermal conductivity material. The gaps thermally insulate the battery from the package body and housing, so that the circuit may be subjected to solder reflow mounting to a circuit board, while insulating the high temperatures from the battery.
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申请公布号 |
US5403782(A) |
申请公布日期 |
1995.04.04 |
申请号 |
US19920995665 |
申请日期 |
1992.12.21 |
申请人 |
SGS-THOMSON MICROELECTRONICS, INC. |
发明人 |
DIXON, D. CRAIG;HUNDT, MICHAEL J. |
分类号 |
H01L25/00;H01L23/495;H01L23/58;H01M2/10;H01M2/20;(IPC1-7):H01L21/60 |
主分类号 |
H01L25/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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