| 摘要 |
<p>PURPOSE:To obtain a low-priced IC package for a high-speed signal capable of coping with even a high clock speed by a method wherein a distance of a wire for an input signal is made shorter than that for an output signal. CONSTITUTION:Using a bonding wire 5 and internal wires 6a, 6b of an IC package, a connection is made from an IC chip 1 to pins 2a, 2b. The pin 2a close to the IC chip 1 is used as a terminal for an input signal, and the pin 2b far from the IC chip 1 is used as a terminal for an output signal, whereby the wire 6a for the input signal is made shorter than the wire 6b for the output signal. Thus, even if a reflection occurs at a receiving IC input terminal, a generation period of reflection waves can be shortened, therefore an influence caused by the reflection waves can be reduced.</p> |
