| 摘要 |
Metal is selectively etched from a substrate by: (i) applying an acrylic negative photoresist to the substrate, (ii) imaging and developing the photoresist, (iii) exposing the photoresist to actinic radiation of wavelength 200-310 nm or 2.4-8 microns, and (iv) contacting the photoresist-coated substrate with an etchant so as to remove portions of the metal not covered with photoresist. |
