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发明名称
Surface Mount Solder Assembly of Leadless Integrated Circuit Packages to Substrates
摘要
申请公布号
CA2127948(A1)
申请公布日期
1995.03.29
申请号
CA19942127948
申请日期
1994.07.12
申请人
AMERICAN TELEPHONE AND TELEGRAPH COMPANY
发明人
DEGANI, YINON;DUDDERAR, THOMAS D.;WOODS, WILLIAM L., JR.
分类号
H01L21/48;H01L21/60;H05K3/12;H05K3/34;(IPC1-7):H01L23/50;H01L23/498
主分类号
H01L21/48
代理机构
代理人
主权项
地址
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