| 摘要 |
PCT No. PCT/CH93/00197 Sec. 371 Date Jul. 15, 1994 Sec. 102(e) Date Jul. 15, 1994 PCT Filed Aug. 5, 1993 PCT Pub. No. WO94/04355 PCT Pub. Date Mar. 3, 1994The heat protection element comprises carrier elements, for example in the form of glass plates. In an interspace between, in each instance, two glass plates a protection layer comprising a cured polysilicate which is formed of alkali silicate and at least one curing agent is disposed. In the polysilicate, a molar ratio of silicon dioxide to alkali metal oxide is set to be greater than 4:1. The starting composition for the polysilicate is a free-flowable composition having a water content of up to 60 percent and capable of being introduced into the interspace between two carrier elements. After curing the composition, the high water content is retained and the polysilicate has nevertheless good inherent strength and adhesion on the carrier elements. |
