发明名称 |
Printed circuit board having through-hole stopped with photo-curable solder resist |
摘要 |
A printed circuit board having a through-hole in a land is disclosed. A solder resist of a photo-curable solder resist is formed on the substrate surface of the printed circuit board and the through-hole is stopped with the same photo-curable solder resist as the solder resist layer. If a land on which a chip component is mounted co-exists with a land on which a discrete component is mounted, only the through-hole in the land on which the chip component is mounted is selectively stopped with the photo-curable solder resist. The solder resist layer and the photo-curable solder resist stopping the through-hole are formed by selective light exposure from both the front and reverse surfaces of the substrate.
|
申请公布号 |
US5402314(A) |
申请公布日期 |
1995.03.28 |
申请号 |
US19930012926 |
申请日期 |
1993.02.03 |
申请人 |
SONY CORPORATION |
发明人 |
AMAGO, HIROHISA;ISHII, SEIMI;KOMATSU, NOBUO;YASUDA, NOBUYUKI |
分类号 |
H05K3/00;H05K3/34;(IPC1-7):H05K7/02 |
主分类号 |
H05K3/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|