| 发明名称 |
Dispersion strengthened lead-tin alloy solder. |
| 摘要 |
<p>Addition of up to 5 vol. % of particles of intermetallics such as Ni3Sn4 and Cu9NiSn3 to a lead-tin alloy solder results into a dispersion strenghtened alloy having an improved strength and durability of the soldered joint obtained therefrom.</p> |
| 申请公布号 |
EP0476734(B1) |
申请公布日期 |
1995.03.22 |
| 申请号 |
EP19910202114 |
申请日期 |
1991.08.20 |
| 申请人 |
PHILIPS ELECTRONICS N.V. |
发明人 |
BETRABET, HEMANT;BOSER, OTMAR;KANE, ROBERT;MCGEE, SUSAN;CAULFIELD, THOMAS |
| 分类号 |
B23K35/26;C22C11/06;C22C13/00;C22C29/00;H05K3/34;(IPC1-7):B23K35/26 |
主分类号 |
B23K35/26 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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