发明名称 MULTILAYER CIRCUIT WIRING BOARD AND CIRCUIT CORRECTING METHOD BASED THEREON
摘要 PURPOSE:To provide a multilayer circuit wiring board that has no limitation to the material for circuit correction, facilitates inspections after circuit correction, and can be easily manufactured. CONSTITUTION:A plurality of terminal connecting pads 2a, 2b, 2c are formed in the uppermost layer of regions where electronic circuit parts are to be mounted. A plurality of layers of wiring 7a, 7b, 7c are formed within the board. A first group of a plurality of pads 3c, 3d for correction, composed of the same metal as the terminal connecting pads, in contact therewith, are formed. A second group of a plurality of pads 3a, 3b, 3e for correction, made of the same metal as the terminal connecting pads, not in contact therewith, are formed. Both the groups are positioned virtually on the same plane as the terminal connecting pads. The circuit is corrected by cutting the wiring 7a, 7b and connecting the correcting pads 3c, 3d in the first group with the correcting pads 3a, 3b in the second group, respectively.
申请公布号 JPH0779080(A) 申请公布日期 1995.03.20
申请号 JP19930222717 申请日期 1993.09.08
申请人 HITACHI LTD 发明人 OGIWARA MAMORU;TANAKA MINORU
分类号 H05K3/22;H05K1/00;H05K3/34;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K3/22
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