| 摘要 |
PURPOSE:To prevent the separation of via sections from an insulating resin layer and the degradation in insulating performance of the insulating resin, by forming a close contact barrier layer on the underside of the via sections in contact with the insulating resin layer to improve the adhesion between the via sections and the insulating resin layer and prevent the diffusion of metal composing the via sections into the insulating resin layer. CONSTITUTION:A close contact barrier layer 22 is formed on the underside of via sections 20 in contact with an insulating resin layer 12. The close contact barrier layer 22 is for improving the adhesion between the insulating resin layer 12 and a metal layer 24 and for preventing metal forming the metal layer 24 from diffusing into the insulating resin layer 12. The close contact barrier layer 22 eliminates the degradation in insulating performance of the insulating resin 12 at the via sections 20. In addition the through holes for the via sections are tapered, and their diameter is smaller with the proximity to the bottom where the land sections 28 of a conductive pattern 17 formed on the underside of the insulating resin layer 12. Therefore, the close contact barrier layer 22, uniform in thickness, can be easily formed by sputtering, for example. When the tapered through holes are filled with metal by plating to form the via sections 22, the conductive pattern is formed simultaneously. |
