| 摘要 |
<p>PURPOSE:To improve the throughput of a washing treatment apparatus which performs the washing treatment of a semiconductor wafer and make the apparatus compact. CONSTITUTION:Stations 32, 33, 34 and 37 on which carriers containing wafers are placed are provided on a placing part 5. An arranging device which aligns the orientation flats of the wafers with each other is provided on a driving mechanism 51 which can move between the respective stations 32, 33, 34 and 37 freely. While the carrier is transferred to a waiting position for the transfer by a transfer device 7, the orientation flats of the wafers in the carrier are aligned with each other. With this constitution, an exclusive orientation-flat alignment device is not necessary and, accordingly, the through-put can be improved and the space occupied by the apparatus can be reduced.</p> |
