| 摘要 |
PURPOSE: To achieve a hard/soft printed circuit board by forming a scheduled rupture part along a separation line between hard and soft ranges by a groove or punching before pressing a single layer. CONSTITUTION: In a hard single layer 1, a scheduled rupture part 2 is manufactured in advance and a conductor path 25 is located on an inner surface. However, a prepreg 8 is placed on the hard single layer 1 and a hole with the same size is placed at the position of an insulation film 5, and the insulation film 5 has an adhesive tape 6a within an adhesion range at a hard single layer side. Then, a layer 6b that is made of an adhesive for maintaining softness even after adhesion is located on an opposite surface, the prepreg 8 is as thick as the polyimide 5 containing coverings 6a and 6b or is thicker than it by severalμm, and a copper foil becomes a flat layer due to the behavior of the fluid of the prepreg 8 after the copper foil is placed and a waveguide 25 is buried completely without any gap. Therefore, a through hole or the waveguide is manufactured on an outer layer and a cover film for covering only the soft part essentially is applied and a contour is machined and a part 3 of the hard single layer is eliminated, thus achieving a hard/soft multilayer circuit. |
