| 摘要 |
<p>PURPOSE:To make thin a package by encapsulating a semiconductor element in a rectangular parallelepiped resin enclosure while partially exposing the bottom face and the side face of a common lead. CONSTITUTION:A semiconductor element 1 is mounted, while being bonded at the electrode part 5 thereof, on a common lead 3 having opposite faces extending in parallel with the semiconductor element 1 bonded thereto upside down. The bottom face and the side face of the common lead 3 are partially exposed, at the continuous surface parts thereof, substantially flush with the outer face of a rectangular parallelepiped epoxy resin sealed enclosure 2, for example. This structure allows thinning of a package.</p> |
