| 摘要 |
PURPOSE:To obtain a lead frame which can be multipin-constructed and the deformation of the inner lead can be prevented. CONSTITUTION:A circuit pattern is formed on an insulative base film 12 of polyimide and the like in the lead frame 10. Through holes 24, 26 and 28 are formed on the base film 12, corresponding to the outer lead 18 of a circuit pattern, and the base film 12 corresponding to the wire bonding section located in the halfway of an inner lead 16, and the outer lead 18 and the wire bonding section of the inner lead 16 are exposed. The tip part of the inner lead 16 is supported on the base film 12. Besides, a plurality of circulation holes 30, for circulation of mold resin, are formed on the base film 12. |
