Method for fitting a power component on a printed circuit board

摘要

In the case of power components (10) the thermally conductive metal layer (14) is not electrically floating, so that a ceramic layer (13), for example, is arranged on the power component for electrical insulation. Both the ceramic layer (13) and the metal layer (14) are produced, according to the invention, using the so-called plasma spraying method, or a similar method. In order to mount the power component (10) on the printed circuit board (11), a solder paste (15) is applied onto the printed circuit board (11) and the component is mounted using so-called reflow soldering. The power component (10) is thus mounted in a simple and cost-effective manner, both in an electrically insulated manner and in a highly thermally conductive manner on the printed circuit board (11), without any additional parts. <IMAGE>