发明名称 |
Method of bonding tungsten titanium sputter targets to titanium plates and target assemblies produced thereby |
摘要 |
A method of producing a sputter target assembly including a tungsten-titanium target attached to a titanium backing plate. The method includes consolidating a tungsten-titanium powder composition to form a target while simultaneously bonding the powder composition to the titanium backing plate to form an interdiffusion-type bond between the target and the backing plate such that the target assembly possesses extremely high temperature operating capability.
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申请公布号 |
US5397050(A) |
申请公布日期 |
1995.03.14 |
申请号 |
US19930144206 |
申请日期 |
1993.10.27 |
申请人 |
TOSOH SMD, INC. |
发明人 |
MUELLER, JOHN J. |
分类号 |
B22F3/16;C23C14/34;(IPC1-7):B22F7/08 |
主分类号 |
B22F3/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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