发明名称 Electronic component and mounting structure thereof
摘要 An electronic component includes a substrate having chip parts. First lead terminals and second lead terminals are led out from one end of the substrate toward an outside. The first lead terminal has a holding portion at an intermediate portion. The second lead terminal has a connecting portion for connecting to the substrate and an inserting portion for inserting to the hole of an external circuit board. The connecting portion and the inserting portion of the second lead terminal is connected with an oblique portion. The holding portion of the first lead terminal is in a same plane perpendicular to the surface of the substrate with a boundary portion between the oblique portion and the inserting portion of the second lead terminal.
申请公布号 US5398166(A) 申请公布日期 1995.03.14
申请号 US19940245924 申请日期 1994.05.19
申请人 MURATA MANUFACTURING CO., LTD. 发明人 YONEZAWA, MASAO;MORIYASU, AKIYOSHI
分类号 H01G2/06;H01L23/50;H05K3/30;H05K3/34;H05K3/36;(IPC1-7):H05K1/11 主分类号 H01G2/06
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