| 摘要 |
PURPOSE:To attain good heat crimping even when these are a thermal expansion difference, misalignment and a dimensional error. CONSTITUTION:In a glass board of small coefficient of thermal expansion and a wiring board 1 of large coefficient of thermal expansion, a plurality of terminals are respectively formed with a space apart from each other, and a plurality of the paired terminals, in a condition that the central terminals are properly arranged, and piled together through an anisotropic conductive film, to perform heat crimping. A space a2 at an ordinary temperature before heat crimping between both end terminals of a plurality of the terminals 2 of the wiring board 1 is formed shorter than a space between both end terminals at a normal temperature before heat crimping of the glass board so that the spaces between both the end terminals are obtained equal to each other when these wiring board and glass board are heated to increase the temperature to the heat crimping temperature. Terminal spaces (j), (h) and terminal widths (m), (l) of a plurality of the terminals 2 of the wiring board 1 are increased symmetrically by a fixed proportional constant respectively to both ends with the central terminal 2 serving as the symmetrical axis. |
