| 摘要 |
<p>PURPOSE:To reduce the gap between chip components in a state that the chip components are arranged in series in the longitudinal direction and to make possible the improvement of the mounting density of the chip components by a method wherein a common land, to where at least two pieces of chip-shaped circuit components can be made an electrical connection in common, is provided. CONSTITUTION:Chip components 11a and 11b, which are a 2125 type square- shaped chip capacitor, for example, are made to arrange in series in such a way that the respective one end of the components 11a and 11b is made a Shared connection to a common land 20a. Moreover, the respective other one end of the components 11a and 11b is made to connect to lands 13a and 13b. The interval between the components 11a and 11b in such a state can be reduced to a dimension (a), which is limited due to the mounting accuracy of a chip component mounter. The dimension (a) is the smallest length between chips in the mounting accuracy of the chip component mounter, is decided in every mounter and the mounting density of the chip components can be improved.</p> |
