| 摘要 |
PURPOSE:To measure the central position of a capillary gouge formed on a ball part while regulating emitting method, and precisely detect the form and displacement of a wire after wire bonding. CONSTITUTION:A lead frame having a semiconductor chip 1 on board is set oh a carrying device 12, and the chip 1 is carried to an inspecting area according to the start signal of a command 33. The chip 1 is lighted 13, 14, and an image pickup device 15 is moved to a set position to correct the positioning error of the chip 1. The device 15 is then moved to read the image of the ball part of a first bonding wire, and its positional coordinate is calculated by central processing unit 31. Further, the central coordinate of a capillary gouge on the ball part is calculated with only the head lighting 14. The device 15 is moved to a sash fastener part, and the same calculation is carried out. This operation is repeated for all wires of the chip 1, and the measurement result is compared with a standard value by the device 31 to judge the quality. Such a series of processing is repeated for a plurality of chips, and the form and displacement of the wire can be precisely detected. |
