| 摘要 |
PURPOSE:To enable mounting of a semiconductor device and substrate, which was not possible according to the conventional structure of the semiconductor device, by a method wherein the interval between tip parts connected to an external board is made wider than the interval between root parts of outer lead parts. CONSTITUTION:An IC chip and inner leads are connected by conductive fine wires, and the inner leads are extended and used as outer leads 2. In addition, a sealing resin 1 covers parts up to the inner leads, and the outer leads are extended toward the outside from the sealing resin 1. At this time, the interval D in parts mounted on a board of the outer leads 2 is made wider than the interval C between parts of the outer leads 2 extracted to the outside from the sealing resin part 1, and the relationship between the intervals C and D is set as C<D. Thereby, the trouble with alignment which has been a problem in the mounting of a semiconductor device in which the interval between mounting positions of the outer leads 2 is a narrow pitch in a product by conventional techniques is relaxed, and a solder bridge is hardly produced. |
