| 摘要 |
PURPOSE: To dissipate heat from an electronic member to a diamond layer and to disperse the heat relatively uniformly over the entire diamond layer by arranging a diamond layer so as to touch the bottom face of a member holding substrate and comes into contact with the electronic member through the member-holding substrate. CONSTITUTION: This circuit assembly 10 is constituted of a member holding substrate 56 having a first surface, i.e., a bottom face 58, and a second surface, i.e., a top face 60, facing a lower surface 58. An opening 62 is made in the substrate 56 extending from the top face 60 to the lower surface 58. The opening 62 has such size as an electronic member 64 consisting of a semiconductor die is received therein. A semiconductor die 64 is fixed to a diamond layer 50 through the opening 62. Furthermore, the semiconductor die 64 has a bottom face 66, which is a first material layer 68 of first solder material being fixed to the layer 50. Since the diamond layer 50 is covered with a tungsten layer 54 and the layer 68 is bonded through the tungsten layer 54 to the diamond layer 50, heat is dispersed uniformly over the entire diamond layer. |
