Topology matched conduction cooling module

摘要

The pistons of a cold plate frame orient themselves as a result of being free to move along one axis and about two other axes by the reflowing of solder tinning on the external surfaces of the pistons and the walls of the recesses within which the pistons reside. As the pistons are permitted to move freely under a biasing force during the solder reflow the face of the piston will engage with the top surface of an electronic chip against which the piston is engaged. The cooling of the solder after reflow will freeze the position and orientation of the piston to that of the electronic chip and will permit enhanced cooling. The cold plate may be disassembled from and reassembled with the components of the cooling system and the electronic chips while maintaining significantly enhanced cooling capabilities.