发明名称 |
SMD-muovikotelo puolijohdepalaa varten |
摘要 |
The housing encapsulates a semiconductor chip (1) with a high frequency component or integrated switch having external wire connections (4) to conductor strips on it. The chip and the connections are carried by a system carrier (2,3). The carrier is a coplanar three band strip conductor with a HF inner conductor (3) and outer conductors (2) alongside and separated from the carrier. Within the housing (6) the outer conductors have a flat connector by which the chip is attached to the end of the inner conductor. |
申请公布号 |
FI950734(A0) |
申请公布日期 |
1995.02.17 |
申请号 |
FI19950000734 |
申请日期 |
1995.02.17 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
BRENNDOERFER, KNUT |
分类号 |
H01L23/04;H01L23/02;H01L23/495;H01L23/66;H05K1/02;H05K3/34 |
主分类号 |
H01L23/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|