| 摘要 |
PURPOSE:To perform the coupling of an optical semiconductor element and an optical waveguide without applying adjustment and with high accuracy and high mass-productivity. CONSTITUTION:The coupling structure of the optical semiconductor element 2 and the optical waveguide 8 is formed by forming a groove 5 at a first substrate 1 on which the optical semiconductor element 2 is packaged, and arranging a short optical fiber 4 on the groove 5 so as to coincide with the height of the light emitting part of the optical semiconductor element 2. While, it is formed by forming a groove 9 on the extension of the optical waveguide 8 of a second substrate 11 on which the optical waveguide 8 is formed, fitting the upper half of the short optical fiber 4 arranged at the first substrate 1 in the groove 9, and coupling the short optical fiber 4 with the optical waveguide 8. Also, the positioning of the optical semiconductor element 2 on the first substrate 1 is performed by providing marks 61, 62 consisting of thin film which blocks infrared rays, etc., at the actual packaging plane of the optical semiconductor element 2 and the surface of the first substrate. The area centroid of the marks 61, 62, etc., can be calculated by irradiating with the infrared rays and applying image processing, and the position of the optical semiconductor element 2 is adjusted so as to obtain coincidence between them. In this way, it is possible to easily couple the optical semiconductor element 2 with the optical waveguide 8 with high accuracy. |
