Method for bonding substrates using molten moisture reactive organosiloxane compositions
摘要
Curable adhesive compositions comprise combinations of organosiloxane MQ resins and liquid polyorganosiloxanes of specified viscosity and functionality. The compositions are substantially free of unreactive materials and are applied in the molten state. Depending upon the concentration of reactive groups on the resin and polyorganosiloxane, the compositions may also include a silane containing an average of more than two hydrolyzable groups per molecule. Preferred compositions develop excellent adhesion to a variety of organic and metallic substrates during curing under ambient conditions.
申请公布号
US5389170(A)
申请公布日期
1995.02.14
申请号
US19930075989
申请日期
1993.06.11
申请人
DOW CORNING CORPORATION
发明人
BRADY, WILLIAM P.;CIFUENTES, MARTIN E.;SCHOENHERR, WILLIAM J.;STICKLES, DAVID L.;STRONG, MICHAEL R.;VANWERT, BERNARD;VINCENT, GARY A.;SCHMIDT, RANDALL G.