| 摘要 |
PURPOSE:To form a fine copper wiring having excellent adhesive property with a ceramic substrate at a low cost in high accuracy by using conductor paste containing glass frit having a relatively high softening point. CONSTITUTION:In the forming method of this minute wiring 18, a photoresist layer 12 is formed on a ceramic substrate 11, and exposure and developing process are performed for the photoresist layer 12. A wiring-pattern-shaped groove part 14 is formed in the photoresist layer 12. Conductor paste 15 containing copper powder, glass frit and vehicle is filled in the groove part 14. Then, heating is performed to a temperature or higher, where the resin in the photoresist layer 12 and the conductor paste 15 is decomposed and dissipated, in atmosphere. The oxidized copper oxide powder is reduced into the copper and sintered. Thus, the highly accurate minute copper wiring having the excellent characteristics of adhesive property with the substrate and the conductivity can be formed on the ceramics substrate. |
