发明名称 A method for the partial metallization of a substrate
摘要 A process for the selective metallization of a substrate and the product formed thereby. An extremely thin (substantially less than the wavelength of light) coat of metallic particles is deposited on a transfer agent. A thin coat of varnish is selectively applied to either the substrate or the transfer agent, the substrate and the transfer agent are laminated together and the varnish is cured. The metallic particles will become absorbed within the varnish and the substrate and transfer agent are then separated. The substrate is provided with a highly polished specular metallic finish in predetermined areas.
申请公布号 AU7327394(A) 申请公布日期 1995.02.13
申请号 AU19940073273 申请日期 1994.07.11
申请人 ALUSIT HOLDINGS, L.P. 发明人 LEE H MILLER
分类号 B05D1/28;B41M5/025 主分类号 B05D1/28
代理机构 代理人
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