| 摘要 |
PURPOSE:To carry out highly precise specular polishing of a semiconductor wafer by controlling applied pressure respectively applied to a marginal part and a central part of a holder plate on which the semiconductor wafer is adhered and stuck in correspondence with shape change of a polishing member. CONSTITUTION:In the case of mechanochemically polishing a semiconductor wafer 2, on the bottom surface of a holder plate 7 for polishing, the semiconductor wafer 2 is adhered by an adhesive and set on a cloth 3 of a lower bottom plate 4, and while rotating the lower bottom plate 4, specular polishing is carried out by the cloth 3. At that time, an air cylinder 5 is extensively moved, the holder plate 7 is pressurized through an O ring 9, and applied pressure is controlled so that the shape of the holder plate 7 corresponds to the shape of the cloth 3. Thereafter, by supplying compressed air to an inside pressing cylinder 10, a rod part 12 is moved downward and a central part of the holder plate 7 is pressurized, and its applied pressure is gradually lowered as cloth using time passes. |
