| 摘要 |
<p>A thermoplastic polyimide polymer suitable for use in making a flexible printed wiring board as a cover lay adhesive excellent in thermal resistance, processability and adhesiveness, a cover lay film, an adhesive layer for a double-sided adhesive sheet or FCCL, etc. The polymer is represented by general formula (1), wherein Ar1, Ar2, Ar4 and Ar6 represent each a bivalent organic group; Ar3 and Ar5 represent each a tetravalent organic group; 1, m and n represent each 0 or a positive integer of 1 or above, provided the sum of 1 and m equals 1 or above; and t represent a positive integer of 1 or above. A thermoplastic polyimide film produced from this polymer has a well-defined glass transition point in a temperature range of 100 to 250 °C and a low-temperature adhesiveness. A polyimide laminate is produced by stacking a layer of the thermoplastic polyimide polymer on one or both sides of a non-thermoplastic polyimide film. A flexible copper-clad laminated board having an excellent peel strength is produced by superimposing a copper foil on the thermoplastic polyimide polymer layer and laminating the assembly near the glass transition point.</p> |
