Familie von demontierbaren Hybridanordnungen unterschiedlicher Größe mit Mikrowellenbandbreitenverbindern

摘要

A family of modular hybrid assemblies with high frequency interconnections is effected by a high frequency circuit assembly 100 attached to a motherboard 110. Each assembly comprises standardized conducting elements 106 and customizable transitions and circuit regions. The customizable transitions can be placed anywhere along the conducting element and are capable of low and high frequency performance. Attachment of the assembly can be effected via a standardized clamping structure 130, 140 which compresses an elastomeric member 120 upon the conducting elements or by bending the conducting elements and soldering to attachment sites on the motherboard. Each member of the family of modular hybrid assemblies provides a controlled impedance transition from a transmission line (712, 720, 714, Fig 7) on the circuit assembly to a transmission line on the motherboard. <IMAGE>