Removable VLSI package.

摘要

A packaging system for VLSI devices is disclosed, offering a high contact density. Each contact element consists of a protruding contact pin (2) on the surface of the device (1) and a recess or cavity (3) on the opposite surface (12) of the respective substrate (5). The cavities are filled with a conductive material (7) of a low melting point composition and sealed with a thin non-conductive foil (4). During packaging, the contact pins on side of the VLSI device penetrate through the foil, partly extending into the conductive alloy, thus revealing electrical contact. To ease the penetration of the foil, the contact pins could be set into oscillating motion by means of an ultrasonic generator.