| 摘要 |
<p>PURPOSE:To provide a method for mounting a fine pitch IC package in which a low-cost solder supplying method having low unevenness of a solder amount is employed. CONSTITUTION:A method for mounting a fine pitch IC package 6 on a printed circuit board 2 comprises the steps of preparing a TAB tape 20 formed with solder patterns 26 at the same pitch as a pitch of leads of the package 6, and soldering conductor lands 3 on the board 2 to leads 8 of the package 6 via the tape 20.</p> |
