| 摘要 |
PURPOSE:To cool a capillary for forming a solder bump from a solder wire, which is heated by a heater stage, to effectively transfer the pressure of the capillary to electrode pads on a semiconductor chip to bond a solder ball so that reliable bonding may be achieved. CONSTITUTION:A wire bonding machine with a source of reducing gas comprises a capillary cooling system, in which cooling gas is blown through a nozzle 11 connected with a pipe 10 to cool a capillary 4 heated by a heater stage 6. The flow rate of the cooling gas is controlled properly by a valve 12 in the cooling system. |
