| 摘要 |
PURPOSE:To obtain a small-size, light-weight semiconductor sealing device raising a productivity by shortening a cycle time of a sealing operation. CONSTITUTION:A table is disposed for moving a pair of mold sets 53 to a press position S1 and an automatic machine position S2. A loader device is disposed adjacently to the automatic machine position S2. An unloader device is disposed adjacently to the automatic machine position S2. At the automatic machine position S2, a mold opening/closing device 57 is provided upward of the mold set 53 for opening/closing the mold set. On the other hand, at the press position S1, a clamping device 56 is provided upward of the mold set 53 for opening/closing a movable platen 49, and a transfer device 61 is provided downward of the mold set 53 for injecting a melted thermosetting resin into a cavity. After the resin initiates curing, dwelling can be conducted at a low pressure by the clamping device and a plunger holding device. |
