发明名称 |
Method for fabricating an interconnected array of semiconductor devices |
摘要 |
A method of forming an array of interconnected solar cells. A flexible substrate carrying semiconductor and conductive layers is divided into individual devices by slitting the substrate along the web length. The individual devices are then connected with one another in series by laminating the substrate onto an insulating backing and by depositing conducting interconnection layers which join the lower conductor of one device with the top conductor of the adjoining device.
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申请公布号 |
US5385848(A) |
申请公布日期 |
1995.01.31 |
申请号 |
US19930123169 |
申请日期 |
1993.09.20 |
申请人 |
IOWA THIN FILM TECHNOLOGIES, INC |
发明人 |
GRIMMER, DERRICK P. |
分类号 |
H01L27/142;H01L31/0392;H01L31/20;H01L51/40;(IPC1-7):H01L31/18 |
主分类号 |
H01L27/142 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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