| 摘要 |
PURPOSE:To reduce the external size of a wiring board on which a wafer-scale integrated circuit is mounted by a method wherein connecting terminals faced at both outer faces of two wafer-scale integrated circuits piled up in such a way that formation faces of semiconductor chips are faced mutually outward are sandwiched by contact parts of connecting members. CONSTITUTION:At a wafer-scale integrated circuit 1, many semiconductor chips 2-2 of various kinds are formed, at high density, on main face sides of thin insulating substrates 2-1 composed of silicon; connecting terminals 2-3 connected to the semiconductor chips 2-2 are formed at end edges; the semiconductor chips 2-2 are piled up in such a way that their formation faces are faced mutually outward. At connecting members 13, opposite contact parts 13-1 which sandwich and become conductive to the connecting terminals 2-3 of the wafer- scale integrated circuit 2 are formed; short-circuit parts 13-2 connected to them are formed. The wafer-scale integrated circuit 2 is placed on the main face of a wiring board 1, and the connecting members 13 are connected to the wiring board 1 by using bonding wires 4. Thereby, the external size of the wiring board 1 on which the wafer-scale integrated circuit 2 is mounted can be made small. |
