发明名称 MOUNTING STRUCTURE FOR ELECTRONIC DEVICE
摘要 PURPOSE:To provide a mounting structure for an electronic device by eliminating a pin neck and improving impedance matching at the connection while permitting high speed signal transmission between multi-chip modules. CONSTITUTION:A high-speed signal transmission line 9 having LSI chips 1 on a printed wiring board 7 is directly connected by a connector 15 for flexible printed wiring board through a flexible printed wiring board 14 without passing through the printed wiring substrate 7.
申请公布号 JPH0730224(A) 申请公布日期 1995.01.31
申请号 JP19910341732 申请日期 1991.12.02
申请人 NIPPON TELEGR & TELEPH CORP <NTT> 发明人 KISHIMOTO TORU;SASAKI SHINICHI
分类号 H01L23/538;H05K1/14;H05K1/18;H05K3/36 主分类号 H01L23/538
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