发明名称 |
MOUNTING STRUCTURE FOR ELECTRONIC DEVICE |
摘要 |
PURPOSE:To provide a mounting structure for an electronic device by eliminating a pin neck and improving impedance matching at the connection while permitting high speed signal transmission between multi-chip modules. CONSTITUTION:A high-speed signal transmission line 9 having LSI chips 1 on a printed wiring board 7 is directly connected by a connector 15 for flexible printed wiring board through a flexible printed wiring board 14 without passing through the printed wiring substrate 7. |
申请公布号 |
JPH0730224(A) |
申请公布日期 |
1995.01.31 |
申请号 |
JP19910341732 |
申请日期 |
1991.12.02 |
申请人 |
NIPPON TELEGR & TELEPH CORP <NTT> |
发明人 |
KISHIMOTO TORU;SASAKI SHINICHI |
分类号 |
H01L23/538;H05K1/14;H05K1/18;H05K3/36 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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