LEAD FRAME AND MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE

摘要

PURPOSE:To provide a lead frame and a semiconductor device mounting structure provided therewith, wherein cracking is prevented from occurring at a joint between the semiconductor device mounting structure and a ceramic board or the like. CONSTITUTION:A semiconductor device mounting structure is equipped with an AlN board 11. A metallized layer 12 is laminated on the AlN board 11. A plating layer 13 is deposited on the upside of the metallized layer 12. The upside of the plating layer 13 is coated with silver blazing alloy 17. An IC chip 15 is mounted on the upside of the silver blazing alloy 17 through the intermediary of solder 14, and the one end of a lead frame 16 is fixed. A groove is provided to the underside of the end of the lead frame 16 which confronts the board 11. A thermal stress acting on a joint can be relaxed by the groove concerned.