FILM COATING MATERIAL CONTAINING PALLADIUM AND WIRING FORMING METHOD USING THE MATERIAL

摘要

PURPOSE:To provide a film coating material for forming wiring pattern uniformly on a board having a large area. CONSTITUTION:This is a film coating material containing palladium in a solution produced by dissolving palladium acetate to acetone to a concentration higher than 70% of saturated concentration. This will be explained here by using an example used for two-step wiring forming method. Palladium acetate is excessively dissolved in acetone and is filtered with a filter. When this solution is applied to a board, its solvent is evaporated and a palladium acetate film is formed on the board. A pattern is scanned with an argon laser beam, and a pattern having a width of 5mum of palladium is formed and washed. Copper wiring is performed on palladium only by electroless copper plating.