| 摘要 |
<p>PURPOSE:To provide a multichip module and an external connection lead provided to it, wherein the multichip module can be bonded to the external connection lead high enough in accuracy to cope with highly dense mounting and wiring, and a bonded joint is high in mechanical strength and heat resistance and hardly disconnected in an after process wherein heat is applied. CONSTITUTION:A single layer or a plurality of layers of wiring layers 3 are formed on a board 2 for the formation of a wiring substrate 1, a plurality of semiconductor chips 4 are mounted on the wiring substrate 1, and an external connection lead 6 is bonded to the external connection terminal 8 of the wiring substrate 1 through the intermediary of a bonding layer 7, whereby a multichip module is formed. The bonding layer 7 is formed on the tip bonding surface of the external connection lead 6 as thick as 10 to 40mum through an electroplating process and made of high-melting solder whose fusing point is higher than a temperature of 210 deg.C or above.</p> |
