| 摘要 |
A device for fixing a chip of a semiconductor element (1) onto a base (3) with a welding (soldering) substance (2) comprises a source of laser light (6) which emits laser light (4) of a wavelength which is transmitted through the base (3), and a means (5) for applying the laser light which is emitted by the source to a defined position, and for radiating this light towards a required part of the base (3). It is thus possible to fix the semiconductor element onto the base in a short time, while observing the operation of the semiconductor element while the welding substance is molten, in order to position it exactly in the desired way on the base. <IMAGE> |
