发明名称 High heat conductive insulated substrate and method of manufacturing the same.
摘要 <p>A high heat conductive insulated substrate comprising a substrate having a heat conductivity of not less than 50 W/m.k and a high heat conductive insulating layer coated on the substrate; and a method for producing such a high heat conductive insulated substrate by forming an insulating layer on a substrate by applying DC voltage and RF power to the substrate and providing magnetic field parallel to the surface of the substrate, are disclosed. The insulated substrate of the present invention has a good heat conductivity, a good thermal resistance and a smooth surface, whereby exfoliation of the film layer can be prevented. <IMAGE></p>
申请公布号 EP0635871(A2) 申请公布日期 1995.01.25
申请号 EP19940112466 申请日期 1986.11.04
申请人 KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA 发明人 YAMAMOTO, KENJI;NAKAYAMA, TAKEHISA;TAWADA, YOSHIHISA
分类号 H01L23/14;H01L23/373;H05K1/05;(IPC1-7):H01L21/00;C23C16/50;H01L23/36 主分类号 H01L23/14
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